Semiconductor packaging structure

ABSTRACT

Packaging structure is provided. A substrate is provided, and an adhesive layer is formed on the substrate. An improvement layer is formed on the adhesive layer. The improvement layer contains openings exposing surface portions of the adhesive layer at bottoms of the openings. A plurality of chips is provided and includes functional surfaces. The plurality of chips is mounted on the substrate such that the functional surfaces are bonded to the adhesive layer at the bottoms of the openings.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.16/393,139, filed on Apr. 24, 2019, which claims priority of ChinesePatent Application No. 201810796545.6, filed on Jul. 19, 2018, theentire content of which is hereby incorporated by reference.

FIELD OF THE INVENTION

The present disclosure generally relates to the field of packaging and,more particularly, relates to packaging structures.

BACKGROUND

With rapid development of integrated circuit manufacturing industry,requirements for packaging technologies of integrated circuits areincreasing. Existing packaging technologies mainly include ball gridarray packaging (BGA), chip-size packaging (CSP), wafer-level packaging(WLP), three-dimensional packaging (3D), and system in package (SiP).Among them, the wafer-level packaging (WLP) is gradually adopted by mostsemiconductor manufacturers due to its advantages. All or most ofprocessing steps of the wafer-level packaging (WLP) may be completed ona silicon wafer whose pre-processes have been completed, and finally thewafer is directly cut into independent devices.

The wafer-level packaging has the following advantages. The wafer-levelpackaging may have a high packaging efficiency. Multiple wafers may beprocessed at a same time. The wafer-level packaging may have advantagesof flip-chip packaging. That is, packaging structures formed by thewafer-level packaging may be light, thin, short, and small. Comparedwith previous processing steps, the wafer-level packaging only adds twoprocessing steps including pin rewiring (RDL) and bump making, and allother processing steps are conventional processing steps. Further, thewafer-level packaging may reduce multiple tests in conventionalpackaging. Accordingly, major IC packaging companies in the worldinvested in the research, development and production of the wafer-levelpackaging.

However, many problems of existing wafer-level packaging technologiesstill need to be solved, and performances of packaging structures formedby existing wafer-level packaging technologies may be still undesirable.The disclosed methods and structures are directed to solve one or moreproblems set forth above and other problems in the art.

BRIEF SUMMARY OF THE DISCLOSURE

One aspect of the present disclosure includes a method of forming apackaging structure. A substrate is provided, and an adhesive layer isformed on the substrate. An improvement layer is formed on the adhesivelayer. The improvement layer contains openings exposing surface portionsof the adhesive layer at bottoms of the openings. A plurality of chipsis provided and includes functional surfaces. The plurality of chips ismounted on the substrate such that the functional surfaces are bonded tothe adhesive layer at the bottoms of the openings.

Another aspect of the present disclosure includes a packaging structure.The packaging structure includes a substrate, an adhesive layer formedon the substrate, and an improvement layer formed on the adhesive layer.The improvement layer has openings exposing surface portions of theadhesive layer at bottoms of the openings. The packaging structure alsoincludes chips located in the openings. The chips include functionalsurfaces that adhere to the adhesive layer.

Other aspects of the present disclosure can be understood by thoseskilled in the art in light of the description, the claims, and thedrawings of the present disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The following drawings are merely examples for illustrative purposesaccording to various disclosed embodiments and are not intended to limitthe scope of the present disclosure.

FIG. 1 illustrates a packaging structure;

FIG. 2 illustrates an exemplary process of forming a packaging structureconsistent with the disclosed embodiments;

FIGS. 3 to 12 illustrate structures corresponding to certain stages ofthe exemplary process of forming a packaging structure consistent withthe disclosed embodiments; and

FIGS. 13 to 15 illustrate structures corresponding to certain stages ofanother exemplary process of forming a packaging structure consistentwith the disclosed embodiments.

DETAILED DESCRIPTION

To make the objectives, technical solutions and advantages of thepresent invention more clear and explicit, the present invention isdescribed in further detail with accompanying drawings and embodiments.It should be understood that the specific exemplary embodimentsdescribed herein are only for explaining the present invention and arenot intended to limit the present invention.

Reference will now be made in detail to exemplary embodiments of thepresent invention, which are illustrated in the accompanying drawings.Wherever possible, the same reference numbers will be used throughoutthe drawings to refer to the same or like parts.

Performances of packaging structures formed by existing wafer-levelpackaging technologies may be undesirable.

FIG. 1 illustrates a packaging structure. As shown in FIG. 1, asubstrate 100 is provided, and an adhesive layer 101 is disposed on asurface of the substrate 100. Chips 102 are provided, and each of thechips 102 includes a functional surface 1. Each of the chips 102 haspads 102 a at the functional surface 1. Each of the chips 102 is mountedon the substrate 100 through the adhesive layer 101 such that thefunctional surface 1 is bonded to the adhesive layer 101.

In the packaging structure shown in FIG. 1, a material of the chips 102includes silicon that has a small thermal expansion coefficient. Athermal expansion coefficient of a material of the adhesive layer 101 ismuch larger than a thermal expansion coefficient of the material of thechips 102. Accordingly, in a subsequent high temperature process,degrees of thermal expansions of the adhesive layer 101 and the chips102 may be different. Thus relative displacements between the chips 102and the adhesive layer 101 may occur, resulting in poor performances ofthe packaging structure.

To solve the above technical problems, the present disclosure provides aforming method of a packaging structure. In the forming method, aplurality of separated improvement layers is formed on top of theadhesive layer, and openings located between adjacent improvement layersmay define chip positions. Thus, chip offsets may be prevented andperformances of the packaging structure may be improved.

FIG. 2 illustrates an exemplary process of forming a packaging structureconsistent with the disclosed embodiments; and FIGS. 3 to 12 illustratestructures corresponding to certain stages of an exemplary process offorming a packaging structure consistent with the disclosed embodiments.

As shown in FIG. 2, at the beginning of the forming process, a substrateis provided, and an adhesive layer is disposed on the substrate (S201).FIG. 3 illustrates a corresponding structure.

As shown in FIG. 3, a substrate 200 is provided, and an adhesive layer201 is disposed on a surface the substrate 200. A material of thesubstrate 200 includes glass, ceramic, metal, or polymer. A shape of thesubstrate 200 includes a circle, a rectangle, or a triangle. Theadhesive layer 201 may make subsequent chips adhere to the surface ofthe substrate 200.

In one embodiment, a material of the adhesive layer 201 is anultraviolet adhesive. The ultraviolet adhesive may have a high viscositywhen it is not irradiated by ultraviolet light. Cross-linking chemicalbonds in the ultraviolet adhesive may be broken after being irradiatedby ultraviolet light, and the viscosity of the ultraviolet adhesive maythus decrease or disappear. Accordingly, the adhesive layer 201 and thesubstrate 200 may be peeled off in a subsequent process.

In some other embodiments, the material of the adhesive layer mayinclude an acrylic pressure sensitive adhesive or an epoxy pressuresensitive adhesive.

A forming process of the adhesive layer 201 includes a spin coatingprocess, a spray coating process, a rolling process, a printing process,a non-rotating coating process, a hot pressing process, a vacuumpressing process, or a pressure pressing process.

The material of the adhesive layer 201 has a first thermal expansioncoefficient, and the first thermal expansion coefficient may be high.

Returning to FIG. 2, after providing the substrate and disposing theadhesive layer, an improvement film may be disposed on the adhesivelayer (S202). FIG. 4 illustrates a corresponding structure.

As shown in FIG. 4, an improvement film 202 is disposed on a surface ofthe adhesive layer 201. A material of the improvement film 202 includesa photoresist, and a forming process of the improvement film 202includes a printing process or a spin coating process. The improvementfilm 202 may be used to subsequently form an improvement layer.

The improvement film 202 has a second thermal expansion coefficient, andthe second thermal expansion coefficient may be high. The differencebetween the second thermal expansion coefficient and the first thermalexpansion coefficient falls within a preset range. Specifically, thepreset range may be approximately −50 to 50. Accordingly, relativedisplacements between the improvement layer 202 and the adhesion layer201 may not easily occur during subsequent high temperature processes.Further, subsequent openings in the improvement layer may limitdisplacements of chips. Accordingly, deflection or warpage of thepackaging structure may be reduced.

Returning to FIG. 2, after the improvement film is disposed on theadhesive layer, the improvement film may be exposed and developed toform an improvement layer (S203). FIG. 5 illustrates a correspondingstructure.

Referring to FIG. 5, the improvement film 202 (see FIG. 4) is exposedand developed to form an improvement layer 220, and openings 203 aredisposed in the improvement layer 220. Since the improvement layer 220is formed from the improvement film 202, the improvement layer 220 hasthe second thermal expansion coefficient. The difference between thesecond thermal expansion coefficient and the first thermal expansioncoefficient falls within the preset range. Accordingly, in subsequenthigh temperature processes, relative displacements between theimprovement layer 220 and the adhesion layer 201 may not easily occur.Moreover, since the openings 203 may limit positions of subsequentchips, relative positions between the chips and the improvement layer220 may not change. As such, relative displacements between the chips,the improvement layer 220 and the adhesive layer 201 may not easilyoccur, and thus the deflection or warpage of the packaging structure maybe reduced.

A depth of the openings 203 is in a range of approximately 10micrometers to 50 micrometers. If the depth of the openings 203 is lessthan approximately 10 micrometers, the depth of the openings 203 may betoo shallow. The openings 203 in the improvement layer 220 may have aweak ability in limiting subsequent chips, and thus the chips may stillbe prone to offset during subsequent process. If the depth of theopenings 203 is greater than approximately 50 micrometers, a process offorming the openings 203 may be difficult.

Returning to FIG. 2, after the improvement layer is formed, chips 204may be provided (S204). FIG. 6 illustrates a corresponding structure.

As shown in FIG. 6, chips 204 are provided. Each of the chips 204includes a functional surface 11, and pads 204 a are disposed in thefunctional surface 11. Each of the chips 204 is mounted on the substrate200 such that the functional surface 11 is bonded to the adhesive layer201 at a bottom of the opening 203 (see FIG. 5).

A material of the chips 204 includes silicon, and the chips 204 have athermal expansion coefficient in a range of approximately 2.2 to 2.4.The pads 204 a may be used to output electrical signals in the chips204. A thickness of the chips 204 is in a range of approximately 20micrometers to 100 micrometers. The chips 204 are mounted on thesubstrate 200 through the adhesive layer 201.

In one embodiment, a surface of the chip 204 is higher than a surface ofthe improvement layer 220, and thus a portion of the chip 204 is locatedin the opening 203. The improvement layer 220 at the sidewall of theopening 203 may limit the position of the chip 204, preventing relativedisplacement between the chip 204 and the improvement layer 220 and theadhesive layer 201. Thus, the deflection or warpage of the packagingstructure may be reduced.

Returning to FIG. 2, after the chips 204 are provided, an encapsulationlayer may be formed on the improvement layer and sidewalls and surfacesof the chips (S205). FIG. 7 illustrates a corresponding structure.

As shown in FIG. 7, an encapsulation layer 205 is formed on a surface ofthe improvement layer 220 and sidewalls and surfaces of the chips 204.The encapsulation layer 205 may protect the chips 204, and may be acarrier of subsequent processes.

In one embodiment, a material of the encapsulation layer 205 is epoxyresin. The epoxy resin has good encapsulation performances and may beeasily molded, and thus the epoxy resin may be a preferred material forforming the encapsulation layer 205.

In some other embodiments, the material of the encapsulation layer maybe an encapsulation material. The encapsulation material includespolyimide resin, benzocyclobutene resin, polybenzoxazole resin,polybutylene terephthalate, polycarbonate, polyethylene terephthalate,polyethylene, polypropylene, polyolefin, polyurethane, polyolefin,polyethersulfone, polyamide, polyurethane, ethylene-vinyl acetatecopolymer, and polyvinyl alcohol.

In one embodiment, a forming process of the encapsulation layer 205includes an injection molding process. In some other embodiments, theforming process of the encapsulation layer may include a transfermolding process or a screen printing process.

The injection molding process for forming the encapsulation layer 205includes providing a mold and filling the mold with an encapsulationmaterial, wherein the encapsulation material covers the chips 204. Theinjection molding process also includes heating and curing theencapsulation material to form the encapsulation layer 205.

In the structure shown in FIG. 7, difference between the thermalexpansion coefficient of the material of the chip 204 and the thermalexpansion coefficients of the improvement layer 220 and the adhesivelayer 201 may be large. But, in the process of forming the encapsulationlayer 205, since a portion of the chip 204 is located in the opening203, the opening 203 may limit the relative displacement between thechip 204 and the improvement layer 220 and adhesion layer 201 during theheating and curing process. Moreover, the difference between the thermalexpansion coefficients of the improvement layer 220 and the adhesivelayer 201 falls within the predetermined range. Thus the relativedisplacement between the improvement layer 220 and the adhesive layer201 may not easily occur during the temperature-raising curing process.As such, the relative displacements between the chip 204, theimprovement layer 220 and the adhesive layer 201 may not easily occur,and the offset or warpage of the packaging structure may thus bereduced.

In one embodiment, after the encapsulation layer 205 is formed, theencapsulation layer 205 is not subjected to a thinning treatment. Insome other embodiments, after the encapsulation c seal layer is formed,the encapsulation layer may be subjected to a thinning treatment untilsurfaces of the chips are exposed.

Returning to FIG. 2, after the encapsulation layer is formed, thesubstrate and the adhesive layer may be removed to expose the functionalsurfaces of the chips (S206). FIG. 8 illustrates a correspondingstructure.

As shown in FIG. 8, after the encapsulation layer 205 is formed, thesubstrate 200 (see FIG. 7) and the adhesive layer 201 (see FIG. 7) areremoved to expose the functional surfaces 11 of the chips 204.

In one embodiment, a material of the adhesive layer 201 is anultraviolet adhesive. A process of removing the substrate 200 (see FIG.7) and the adhesive layer 201 (see FIG. 7) includes irradiation withultraviolet light. Due to the irradiation with ultraviolet light,adhesiveness of the adhesive layer 201 may decrease, and thus theadhesive layer 201 and the substrate 200 may be peeled off.

The functional surfaces 11 of the chips 204 are exposed after thesubstrate 200 (see FIG. 7) and the adhesive layer 201 (see FIG. 7) areremoved. Subsequently, a wiring layer may be formed on the functionalsurfaces 11, and soldering balls may be formed on a surface of thewiring layer. The wiring layer is electrically connected to the pads 204a.

Returning to FIG. 2, after the substrate and the adhesive layer areremoved, a wiring layer may be formed on the pads (S207). FIG. 9illustrates a corresponding structure.

Referring to FIG. 9, after the substrate 200 and the adhesive layer 201are removed, a wiring layer 206 is formed on surfaces of the pads 204 a.A material of the wiring layer 206 may be a metal, such as aluminum,copper, tin, nickel, gold or silver. A forming process of the wiringlayer 206 includes an evaporation process, a sputtering process, anelectroplating process, or a chemical plating process.

A bottom of the wiring layer 206 is electrically connected to tops ofthe pads 204 a, and a top of the wiring layer 206 is electricallyconnected to subsequent solder balls.

Returning to FIG. 2, after the wiring layer is formed on the surfaces ofthe pads, a passivation layer may be formed on the improvement layer andsidewalls of the wiring layer (S208). FIG. 10 illustrates acorresponding structure.

As shown in FIG. 10, a passivation layer 207 is formed on a surface ofthe improvement layer 220 and sidewalls of the wiring layer 206. Thepassivation layer 207 has solder openings 208 exposing a surface of thewiring layer 206.

A material of the passivation layer 207 includes polyimide,polyparaphenylene benzobisoxazole or photosensitive benzocyclobutene. Aforming process of the passivation layer 207 includes a spin coatingprocess or a printing process.

As the passivation layer 207 exposes a portion of the wiring layer 206,solder balls may be electrically connected to the wiring layer 206 in asubsequent process. The solder openings 208 may accommodate solder ballsin a subsequent process.

Returning to FIG. 2, after the passivation layer is formed, solder ballsmay be formed in the solder openings (S209). FIG. 11 illustrates acorresponding structure.

As shown in FIG. 11, solder balls 209 are formed in the solder openings208 (see FIG. 10). The solder balls 209 include gold tin solder balls,silver-tin solder balls or copper-tin solder balls.

In one embodiment, the solder balls 209 are gold-tin solder balls. Aprocess of forming the gold-tin solder balls includes forming a gold-tinlayer in the solder openings 208. After the gold-tin layer is formed, ahigh temperature reflow process is performed to make the gold-tin layerreflow into a spherical shape, and the gold-tin solder balls are formedafter temperature is decreased.

Returning to FIG. 2, after the solder balls are formed in the solderopenings, a dicing process may be performed to form chip structures(S210). FIG. 12 illustrates a corresponding structure.

Referring to FIG. 12, after the solder balls 209 are formed, a dicingprocess is performed to form chip structures 250.

In one embodiment, the chip structures 250 do not include theimprovement layer 220, and thus a subsequent process of removing theimprovement layer 220 is not required. Accordingly, some processingsteps may be omitted, and process complexity may thus be reduced.

In one embodiment, after the chip structures 250 are formed, theencapsulation layer 205 is not thinned. In some other embodiments, afterthe chip structures 250 are formed, the encapsulation layer is thinneduntil the surface of the chip is exposed.

FIGS. 13 to 15 illustrate structures corresponding to certain stages ofanother exemplary forming process of a packaging structure.

Referring to FIG. 13, a dicing process is performed to form chipstructures 300. It should be noted that the chip structure 300 shown inFIG. 13 is formed from the structure shown in FIG. 11. In oneembodiment, the chip structure 300 includes a portion of the improvementlayer 220.

Referring to FIG. 14, after the chip structures 300 are formed, theimprovement layer 220 is removed. A process of removing the improvementlayer 220 includes one or a combination of a dry etching process and awet etching process.

Referring to FIG. 15, after the improvement layer 220 is removed, theencapsulation layer 205 is thinned until the surface of the chip 204 isexposed.

In one embodiment, after the improvement layer 220 is removed, theencapsulation layer 205 is thinned. In some other embodiments, after theimprovement layer is removed, the encapsulation layer 205 is notthinned.

The present disclosure also provides a packaging structure. Referring toFIG. 6, the packaging structure includes a substrate 200, wherein anadhesive layer 201 is disposed on a surface of the substrate 200. Thepackaging structure also includes an improvement layer 220 disposed on asurface of the adhesive layer 201. The improvement layer 220 hasopenings 203 (see FIG. 5), and bottoms of the openings 203 expose thesurface of the adhesive layer 201. The packaging structure also includeschips 204 located in the openings 203. The chips 204 includes functionalsurfaces 11 that adhere to the adhesive layer 201. Surfaces of the chips204 are higher than a surface of the improvement layer 220. The adhesivelayer 201 includes an ultraviolet adhesive, an acrylic pressuresensitive adhesive, or an epoxy pressure sensitive adhesive. A materialof the improvement layer 220 includes a photoresist.

As disclosed, the technical solutions of the present disclosure have thefollowing advantages.

In the process of forming a packaging structure provided by thetechnical solutions of the present invention, the improvement layercontains openings for subsequently receiving chips. Moreover, theimprovement layer at sidewalls of the openings may prevent the chipsfrom being offset. Accordingly, the process may improve performances ofthe packaging structure.

The embodiments disclosed herein are exemplary only and not limiting thescope of the present disclosure. Various combinations, alternations,modifications, or equivalents to the technical solutions of thedisclosed embodiments can be obvious to those skilled in the art and canbe included in the present disclosure. Without departing from the spiritand scope of the invention, such other modifications, equivalents, orimprovements to the disclosed embodiments are intended to be encompassedwithin the scope of the present disclosure.

What is claimed is:
 1. A packaging structure, comprising: a substrate;an adhesive layer formed on the substrate; an improvement layer formedon the adhesive layer, wherein the improvement layer includes openingsthere-in, exposing surface portions of the adhesive layer at bottoms ofthe openings; and chips located in the openings, wherein the chipsinclude functional surfaces that adhere to the adhesive layer.
 2. Thepackaging structure according to claim 1, wherein the substrate is madeof a material including glass, ceramic, metal, or polymer.
 3. Thepackaging structure according to claim 1, wherein top surfaces of thechips within the openings in the improvement layer are higher than a topsurface of the improvement layer.
 4. The packaging structure accordingto claim 3, wherein the chips have a thickness in a range ofapproximately 20 micrometers to 100 micrometers.
 5. The packagingstructure according to claim 3, wherein the openings has a depth in arange of approximately 10 micrometers to 50 micrometers.
 6. Thepackaging structure according to claim 1, wherein the adhesive layerincludes an ultraviolet adhesive, an acrylic pressure sensitiveadhesive, or an epoxy pressure sensitive adhesive.
 7. The packagingstructure according to claim 1, further comprising: an encapsulationlayer, on the improvement layer and sidewalls and surfaces of theplurality of chips; a wiring layer on the functional surfaces and apassivation layer on the wiring layer, wherein the passivation layer hassolder openings exposing a portion of the wiring layer; and solder ballsin the solder openings.
 8. The packaging structure according to claim 7,wherein the wiring layer is made of a material including a metal, suchas aluminum, copper, tin, nickel, gold or silver.
 9. The packagingstructure according to claim 7, wherein the passivation layer is made ofa material including polyimide, polyparaphenylene benzobisoxazole orphotosensitive benzocyclobutene.
 10. The packaging structure accordingto claim 1, wherein: the chips are mounted on the substrate, thefunctional surfaces of the chips are bonded to the adhesive layer at thebottoms of the openings and in contact with the adhesive layer, and eachchip is mounted within a corresponding opening of the openings.
 11. Thepackaging structure according to claim 1, wherein: the improvement layeris made of a material including a photoresist.
 12. The packagingstructure according to claim 1, wherein: the improvement layer atsidewalls of each opening confines a position of a corresponding chipwithin the opening.